Description
Article no.: 505101
| Application area: | Soldering machine cleaning |
| Appearance/smell: | Colourless to slightly yellow, clear |
| Application: | Ready-to-use |
| ph-value: | Alkaline |
| Density at 20 °C: | 0.997 +/- 0.005 g/cm³ |
| Boiling point/boiling range: | >100 °C |
| System: | Waterbased |
| Operations temperature: | Room temperature |
| Reliable cleaning results with: | Flux residues, Condensate from PCB boards |
| Durability: | 36 month |
| Storage conditions: | Ideal in original packaging at 10°C–25°C |
| Transportation: | Non-DG |
The water-based, alkaline cleaning medium efficiently removes flux residues and outgassing from circuit boards from reflow-, wave-, selective- and vapour-phase soldering systems. Due to the foaming formula, an improved effect is achieved, even when used with still hot soldering machines. Very mild odour.
The cleaning medium is sprayed onto the surfaces to be cleaned at room temperature and wiped off after a few minutes. Due to the innovative formula, when reaching soldering temperatures of >200 degrees, no cleaning agent residues of any kind remain in the soldering machine system.