Description
Article no.: 505113
| Application area: | (Automatic) SMT stencil cleaning |
| Appearance/smell: | Colourless to slightly yellow, clear/low odor |
| Application: | 1 part concentrate: 4 parts DI water |
| ph-value: | Alkaline |
| Density at 20 °C: | 0.923 +/- 0.005 g/cm³ |
| Boiling point/boiling range: | >100 °C |
| System: | Waterbased (ready-mix) |
| Operations temperature: | Room temperature |
| Reliable cleaning results with: | Leaded, lead-free, no-clean solder pastes, SMT-adhesives |
| Durability: | 36 month |
| Storage conditions: | Ideal in original packaging at 10°C–25°C |
| Transportation: | Non-DG |
The water-based, alkaline cleaning concentrate is diluted in the ratio 1:4 with DI water (corresponds to ready to use Etimol SW 26 RAA. SKU#5105) and then efficiently removes residues of solder paste containing lead, lead-free or No-Clean solder pastes as well as of SMT adhesives from SMD stencils in automatic washing machines.
The alkaline formula features excellent compatibility with the common stencil materials, and especially with fine pitch stencils containing micro-BGA. Due to the innovative formula, high bath loading values are achieved in comparison to standard cleaners, so that the intervals between the bath changes can be extended significantly and the resulting volumes of waste for disposal are reduced.
The cleaner can be excellently rinsed with water and itself. The cleaning medium is filled in the cleaning tank of the stencil washing system at room temperature.