Flux GSP-2533RX-OVAP No Clean, 20 L

This low-solid flux is a special, cost-effective variant of the proven GSP-2533RX. Despite the low solid content of only 2.5%, sufficient activity is achieved even for lead-free solder alloys. GSP-2533RX-OVAP is not suitable for foam flux application! In practice, it has been shown that, when used properly, washing of printed circuit boards soldered with this flux can largely be avoided. The GSP flux is characterized by increased resistance values and very clean surfaces. IC testing with needle adapters is only very rarely affected. - very clean result - for dual-wave - for soldering SMD components - with synthetic resin, high electrical safety - low consumption - very good wetting properties - DIN ISO 9454 1.2.3 (F-SW33) - Contents: 20 L