Flux GSP-2533RX-OVAP No Clean, 5 L

This low-solids flux is a special, cost-effective variant of the proven GSP-2533RX. Despite the low solids content of only 2.5%, it achieves sufficient activity even for lead-free solder alloys. GSP-2533RX-OVAP is not suitable for foam flux application! Practical experience has shown that, when used properly, washing of PCBs soldered with this flux can largely be dispensed with and, unlike “resin-free products,” “GSP fluxes” are characterized by higher resistance values and very clean surfaces on the soldered boards. IC testing with needle adapters is only very rarely affected. - very clean result - for dual-wave - for soldering SMD components - with synthetic resin, high electrical safety - low consumption - very good wetting properties - DIN ISO 9454 1.2.3 (F-SW33) - Contents: 5 L