Lead-containing No Clean solder paste, SC-170, 15-30 µm, can, 500 g

SC-170 solder paste is an RMA paste that meets the requirements of MIL-QQ-S571e. It has passed the corrosion, solder ball, and wetting tests, as well as the contour stability test (per SN 59650). Laboratory tests confirm corrosion-free residues that comply with RE L0 (F-SW 32) “no-clean” standards, which can remain on the printed circuit board without concern, even under the protective coating.- Type RE-L0 - excellent contour stability - no solder ball or splatter formation - long-term workability and long shelf life - high temperature stability - crystal-clear, low residue (4.5%) facilitates "in-circuit" testing - contains corrosion inhibitors - excellent print quality - 24-hour pot life - for "fine and super fine pitch" applications - particle size: 15-30 µm - Type: Can - Contents: 500 g