Lead-free solder paste, LFM 48W SUC UI, 10–28 µm, 500 g can

The paste enables a transition from nitrogen-assisted soldering to nitrogen-free soldering. - O? reflow, minimal voids, and high preheat temperature - Consistent paste volume and print quality - Good wetting even under normal O? atmosphere - Dimensionally stable on all components - Nitrogen is not required, which helps reduce operating costs - Reduced energy consumption contributes to lower CO? emissions - Good wetting on nickel surfaces - Can eliminate BGA wetting problems and "head-in-pillow" defects - High reliability thanks to "no-clean" flux - Particle size: 10–28 µm - Contents: 500 g can