No-Clean Solder Paste, BLF-02, 15-30 µm, Can, 200 g

BLF 02 solder paste is a sophisticated high-tech product suitable for all lead-free SMT applications. Its development is based not only on the latest findings in soldering chemistry, many years of experience in the SMT field—including ongoing collaboration with users of vapor phase soldering systems—but also on careful and strict adherence to the guidelines of ISO, EN, IPC, and MIL standards.- Type RE-L1 - excellent contour stability - no solder balling or spattering - long-term workability and long service life - high temperature stability - low-solids paste with only 4.6% residue - residues comply with the RE-L0 classification - contains corrosion inhibitors - Excellent print quality - Leaves no tar-like residues in the soldering system - Particle size: 15–30 µm - Type: Can - Contents: 200 g