No-Clean Solder Paste, BLF-03, 25-45 µm, Semco, 1,000 g

The BLF03 is a consistently refined high-tech product that is ideally suited for all so-called lead-free SMT applications. Its development is based not only on many years of experience in the SMT field, but also on careful and strict adherence to the guidelines of ISO, EN, IPC, and MIL standards. - Type RE-L0 - excellent contour stability - no solder ball or splatter formation - exceptionally long workability and long shelf life - high temperature stability - clear, low residue (only 4.5%), facilitates "in-circuit" testing - No-clean paste - contains corrosion inhibitors - excellent print quality - extremely high adhesion - particle size: 25–45 µm - Type: Semco - Net weight: 1,000 g