Solder paste, LFM-48 TM-HP, 20–38 µ, 500 g can

Optimized solder paste for consistent printability, minimized flux splatter, and higher preheating temperatures.- Good continuous printability - Minimizes viscosity increase over time - Enables uniform printing - Improved protection against thermal flux damage and surface oxidation - Can be used without cleaning - Particle size: 20–38 µm - Contents: 500 g can