Solder paste, SJM-03W GT(R)-S, 20–38 µm, 500 g can

Perfect performance in the SMT process! Do you think soldering defects in the SMT process are unavoidable? No, that’s not true! Discover the GT-R and NH-IMT solder pastes. They guarantee optimal wetting on a wide variety of surface materials and minimize soldering defects. The no-clean solder paste in the GT series offers higher joint strength than standard SAC or TSC alloys. The Almit solder paste in the GT series features, among other things, excellent cohesion properties, making it highly suitable for pin-in-paste applications. The solder flows exceptionally well along the lead pins into the through-holes. - High preheating temperature, perfect print pattern - Optimal wetting - Very wide range of applications - Designed for PIP/THR - Excellent print quality on the smallest structures - RoHS-compliant - Suitable for copper, nickel, brass, phosphor bronze, and more - Particle size: 20–38 µm - Contents: 500 g can